FREE Webinar The reliability and manufacturability of BGA devices is becoming more dependent on the PCB structure, layout and chassis design. With every increasing part densities the chassis design (PCB mounting), board layout, and underfills can cause additional stresses to be applied to the BGA device beyond just the thermal expansion mismatch. This presentation will cover some of the thermal-mechanical issues, manufacturing defects, and modeling techniques that can be used to help determine the reliability of BGA devices. Speaker(s): Nathan Blattau, Agenda: 11:00 AM Technical Presentation 11:45 AM Questions and Answers 12:00 PM Adjournment Virtual: https://events.vtools.ieee.org/m/337840