“Additive Manufacturing of Microelectronics Including Passive and Active Components for 3D HI and Advanced Packaging”
You are cordially invited to attend SMTA Boston chapter//iMAPS NE/IEEE Boston Reliability joint evening meeting at Kostas Research Institute (KRI) on the Northeastern University Innovation Campus. Topic: "Additive Manufacturing of Microelectronics Including Passive and Active Components for 3D HI and Advanced Packaging" Presented by: Prof. Ahmed Busnaina, Ph.D. of Northeastern University Date: Wednesday, Feb. 11, 2026 Time: 5:00 PM Location: Kostas Research Institute (KRI) on the Northeastern University Innovation Campus Dinner Cost: Free, but Pre-Registration is Required Limit of 40 Attendees. (https://smta.org/events/EventDetails.aspx?id=2030953) A new high-throughput additive manufacturing of nano and microelectronics utilizes direct assembly of nanoscale particles onto interposers, wafers, or boards. The technology enables the printing of inorganic conductors, semiconductors and dielectrics. It has been demonstrated for printing passive and active components including logic gates at the nano and microscale. Transistors with an on/off ratio greater than 10 6 have been demonstrated. This technology enables the fabrication of nanoelectronics and electronic components while reducing the cost by 10 to 100 times compared to conventional fabrication and can print 1000 times faster than ink-jet-based printing. Results show high-throughput printing of interconnects and circuit components at a scale equal to or less than 2 microns. Fully additively manufactured capacitors printed on silicon, sapphire, and polymer substrates will be presented. The results will show printed capacitors ranging down to 20 x 20 µm with capacitance of femto farads to nano farads. The results will also show additively printed MOSFET and logic gates such as NAND with high on/off ratios. A fully automated printing platform (a Fab-in-a-Box) was designed and built for printing microelectronics with minimum-sized features down to 300 nm for several advanced packaging applications and will be presented. Speaker(s): Ahmed A. Busnaina, Ph.D., Agenda: Agenda: 5:00 PM - 6:00 PM - Registration and Networking 5:30 PM - 6:00 PM - Dinner 6:00 PM - 7:00 PM - Feature Technical Presentation 7:00 PM - Tour & Networking 8:30 PM - Adjourn Bldg: Kostas Research Institute (KRI), Northeastern University Innovation Campus, 141 South Bedford Street, Burlington, Massachusetts, United States