Week of Events
Technical Meeting and Facilities Tour of New England Die Cutting (NEDC): Adhesives 101
Technical Meeting and Facilities Tour of New England Die Cutting (NEDC): Adhesives 101
Join Henkel Loctite Application engineers for a 60 to 90+ minute adhesives technology training, Q&A session, and specific application discussions. Our Loctite OEM Seminar is basically our full one day Loctite OEM Customer Training School Workshop condensed down to a 60 to 90+ minutes session. It is essentially an “Adhesives 101” type presentation that includes several hands on demos, pros and cons of all the different Loctite OEM adhesive chemistries offered through our General Industries Division, new products updates, dispense & curing equipment options, and lastly resources available to your company and how to go about selecting and testing appropriate adhesives for your specific applications. It is very appropriate for both new and seasoned design, manufacturing & process engineers or anyone else interested in adhesives. Who Should Attend: Anyone interested in the current use or future use of adhesives for their adhesive assembly applications. What You Will Learn: Basic adhesives joint design guidelines, product data sheet review, advantages & limitations of adhesives, a review of core chemistries of current Loctite General Industries Product Line, how to select an adhesive, dispense & curing equipment options, Loctite available resources to help with your adhesive applications. Please Register at the following SMTA website: (https://smta.org/events/EventDetails.aspx?id=1950784&group=225199) Co-sponsored by: SMTA/iMAPS Agenda: 5:00 PM – 6:30 PM Registration, Facility Tours, Networking and Dinner 6:30 PM – 6:45 PM Greetings, Announcements 6:45 PM – 6:55 PM Host Introduction – New England Die Cutting (NEDC) 6:55 PM – 7:00 PM Speaker Intro 7:00 PM – 8:15 PM Feature Technical Presentation 8:15 PM – 8:30 PM Q&A 8:30 PM – 8:45 PM Closing Announcements, Facility Tours, and Networking 8:45 PM Adjourn 96 Milk St, Methuen, Massachusetts, United States, 01844
Hybrid – COMSOL Multiphysics and the Uncertainty Quantification Module
Hybrid – COMSOL Multiphysics and the Uncertainty Quantification Module
Kourosh K. Taheri, Ph.D. Andrew Strikwerda, Ph.D. (Technical Sales Manager, Energy) (Applications Manager, Electromagnetics) Abstract The Uncertainty Quantification Module, an add-on to the COMSOL Multiphysics® software, is designed to address the limitations of deterministic simulations by incorporating the inherent uncertainties found in real-world applications. Simulations typically assume that input data are fixed, and outputs can be computed with high accuracy. However, this deterministic approach does not account for the variability present in practical scenarios such as manufacturing processes, where significant uncertainty exists. The Uncertainty Quantification Module offers a uniform interface for screening, sensitivity analysis, uncertainty propagation, reliability analysis, and inverse UQ. It can be integrated with other COMSOL products to enable uncertainty analysis in electromagnetics, structural mechanics, acoustics, fluid dynamics, heat transfer, and chemical engineering simulations. The software brings fully coupled Multiphysics and single-physics modeling capabilities, model management, and user-friendly tools for building simulation applications. In this presentation, we will first introduce the COMSOL Multiphysics software and demonstrate the workflow by constructing a simple proof of concept model. We will then discuss the Uncertainty Quantification Module, and how it can be incorporated into a Multiphysics simulation. Agenda: PLEASE NOTE THE NEW 5PM START TIME FOR THIS MEETING 5:00 PM Networking and light dinner 5:30 PM Technical Presentation 7:00 PM Questions and Answers 7:15 PM Informal Q&A and networking 7:30 PM Adjournment Bldg: Main Cafeteria, Lincoln Laboratory, 244 Wood St, Lexington, Massachusetts, United States, 02421, Virtual: https://events.vtools.ieee.org/m/475215
Hybrid – COMSOL Multiphysics and the Uncertainty Quantification Module
Hybrid – COMSOL Multiphysics and the Uncertainty Quantification Module
Kourosh K. Taheri, Ph.D. Andrew Strikwerda, Ph.D. (Technical Sales Manager, Energy) (Applications Manager, Electromagnetics) Abstract COMSOL Multiphysics® is a general-purpose simulation software used in all fields of engineering, manufacturing, and scientific research. The software brings fully coupled Multiphysics and single-physics modeling capabilities, model management, and user-friendly tools for building simulation applications. All add-on products from the product suite connect seamlessly with COMSOL Multiphysics® for a modeling workflow that remains the same regardless of what you are modeling. The Uncertainty Quantification Module, an add-on to the COMSOL Multiphysics® software, is designed to address the limitations of deterministic simulations by incorporating the inherent uncertainties found in real-world applications. Simulations typically assume that input data are fixed, and outputs can be computed with high accuracy. However, this deterministic approach does not account for the variability present in practical scenarios such as manufacturing processes, where significant uncertainty exists. The Uncertainty Quantification Module offers a uniform interface for screening, sensitivity analysis, uncertainty propagation, reliability analysis, and inverse UQ. It can be integrated with other COMSOL products to enable uncertainty analysis in electromagnetics, structural mechanics, acoustics, fluid dynamics, heat transfer, and chemical engineering simulations. In this presentation, we will first introduce the COMSOL Multiphysics software and demonstrate the workflow by constructing a simple proof of concept model. We will then discuss the Uncertainty Quantification Module, and how it can be incorporated into a Multiphysics simulation. Agenda: PLEASE NOTE THE NEW 5PM START TIME FOR THIS MEETING 5:00 PM Networking and light dinner 5:30 PM Technical Presentation 7:00 PM Questions and Answers 7:15 PM Informal Q&A and networking 7:30 PM Adjournment Bldg: Main Cafeteria, Lincoln Laboratory, 244 Wood St, Lexington, Massachusetts, United States, 02421, Virtual: https://events.vtools.ieee.org/m/475215
Microservices Antipatterns (Programming Languages Series No: II)
Microservices Antipatterns (Programming Languages Series No: II)
Description: We will present the essential characteristics of a microservices based architecture, and their benefits. We will then present a list of common microservice antipatterns. For each antipattern, we will explain what characteristics of good architecture it violates, and the harm it does. Finally, we will list some techniques to avoid it in your applications. Speaker(s): Mayank Prakash, Agenda: 6:30 Introduction 7:00 Talk starts 8:30 Questions 8 Van de Graaff Drive, Burlington, Massachusetts, United States