I will share here our experiences with our talks with Senators and Congresswomen Congressmen. Today's meeting date will be my 20th Year Anniversary with Oracle, too. we will celebrate together. There were 4 main topics that were discussed: We talked to Senator Jean Shaheen, Senator Maggie Hassan, Congressman Chris Pappas and Congresswoman Maggie Goodlander. From Dartmouth College: PhD Innovation Fellow and IEEE Dartmouth Student Chapter President Varsha Shukla attended the annual IEEE-USA Congressional Visits Day in Washington, DC. The delegation of engineers, researchers, and technology professionals engaged with elected officials to raise visibility of and support for engineering and technology. Shukla joined the NH delegation in meetings with legislative offices to discuss AI governance, federal R&D investment, technology transfer, and STEM workforce development. "It was deeply encouraging to witness firsthand the thoughtful leadership and genuine curiosity from government officials on matters of emerging technology and innovation,” said Shukla. All Senators and Congresswomen and Congressmen were very positive and supportive for Create AI Act and small business support and innovation support. They were very productive talks. I would like to thank all Senators and Congresswomen and Congressmen and IEEE USA Staff and all who joined to contribute to this amazing meetings. From Jonathon Choe, Social Media Advocate at IEEE USA: Before we close things off on this year's fantastic event, we'd like to request of you all for a few final things: 1. Please fill out the feedback form(s) We appreciate the positive feedback we've already received, and hope you found the experience both valuable and impactful. If you haven’t yet shared your thoughts, please take a moment to complete our feedback survey here: https://lnkd.in/e5tY-AAV. Your insights are vital to helping us continue improving future events. 2. Post! We’d also like to thank everyone for your enthusiasm in capturing moments through photos and videos during CVD. Just a reminder to post all the great photos you took and tag us @IEEEUSA and use the hashtags (https://www.linkedin.com/search/results/all/?keywords=%23ieeeusa&origin=HASH_TAG_FROM_FEED) and (https://www.linkedin.com/search/results/all/?keywords=%23ieeeusacvd&origin=HASH_TAG_FROM_FEED) when posting. To continue posting to our group album, use this link: https://lnkd.in/eYWVg5CW 3. Engage! As we continue to advance issues critical to our community, we encourage you to stay engaged with IEEE-USA by joining one of our policy committees. Get involved and help shape the future by visiting https://lnkd.in/e4Txanvs for more information and to sign up. Best regards Bldg: Dunkin, 239 Main Dunstable Rd., NASHUA, New Hampshire, United States, 03062

Electronics play a crucial role across all industry sectors, especially as systems become more interconnected, cloud-based, electrified, and powered by artificial intelligence (AI). This applies not only to existing electronics but also to emerging technologies pushing the boundaries of scale, data speed, power, and AI-driven innovations. Emerging technologies that are major drivers for electronics growth include Hyperscalars driven by AI and machine learning, IOT, EV and autonomous vehicles. Generative AI has been driving demand for high performance GPU based servers and increased loads at data centers. Chip makers have in turn been focused on development of MPUs and GPUs optimized for AI. 5 and 6G applications likewise require sensing, computation and transfer of large volumes of data without latency. All these applications have been pushing electronics towards heterogenous integration with 2.5 and 3D chiplets which allow for greater speeds, functionality and smaller footprints. However, these newer designs, materials and shrinking of scale cause thermal management and reliability issues in electronics introducing new failure sites and modes. This seminar will focus on the critical role reliability plays in the design, manufacturing, and long-term performance of electronic systems. The presentation will start with an overview of the semiconductor supply chain, answering questions such as “who are the key players in various industries?” and “what is driving innovation and how is it taking shape?” The session will continue with addressing key foundational electronics reliability concepts such as the bathtub curve, the difference between reliability physics and handbook calculations, prognostic health management, and common failure mechanisms. Additional time will be spent describing the reliability challenges presented by advanced packaging, like 3D heterogeneous integrated packages To address the evolving topic of electronics reliability as industry needs evolve, Ansys, in collaboration with IEEE, is hosting an Electronics reliability tutorial series that explore electronic component reliability, key electronic failure mechanism and root cause, manufacturing reliability, and simulation/testing for reliability. These tutorials are offered as bundles for continuing education credit with an electronics reliability certificate from IEEE. Speaker(s): Dr. Jon Kordell, Bldg: Main Cafeteria, MIT Lincoln Laboratory, 244 Wood Street, Lexington, Massachusetts, United States, 02421, Virtual: https://events.vtools.ieee.org/m/483183

This IEEE New Hampshire meeting provides a unique opportunity for members and professionals to connect, exchange knowledge, and explore industry trends. The agenda includes an open-floor discussion on topics of interest identified by members and participants, including emerging technologies, AI, cybersecurity, and consulting best practices. Members are encouraged to take the lead in discussions, sharing insights and best practices. The session will also provide networking opportunities to foster collaboration. If you are interested in leading a discussion, please email the topic and brief one paragraph summary by April 11th to rajeshwarvv@yahoo.com. Speaker(s): Raj Vayyavur Agenda: Welcome & Introductions (5 min) Member Interests & Discussion Topics (45 min) Networking & Collaboration Opportunities with Pizza and Drinks (30 min) Next Steps & Closing Remarks (10 min) Room: Classroom Conference Room, 50 Woodmont Ave, Londonderry, New Hampshire, United States

May NH Section ExCom meeting Virtual: https://events.vtools.ieee.org/m/461767