AI and education in crisis contexts: Bridging gaps and creating opportunities (AI Talks with Coffee/Tea # 21)

Virtual: https://events.vtools.ieee.org/m/484339

Amid ongoing armed conflicts, climate change, forced displacement, and other prolonged crises, nearly a quarter of a billion children—an increase of 35 million over the past three years—are deprived of access to quality education. As the global community seeks innovative solutions to address these complex challenges, the responsible use of artificial intelligence (AI) presents a promising opportunity to support the learning needs of children in crisis by expanding access, personalizing instruction, and strengthening educational systems in even the most fragile contexts. Multiple initiatives have sought to use generative AI for good in crisis contexts. AI-powered platforms have the potential to shift how learning happens, including by providing tailored learning experiences and assisting in synthesizing relevant learning materials. On May 13, the Center for Universal Education will host a panel discussion on emerging strategies for using AI in education in crisis contexts. Moderated by senior fellow and director Rebecca Winthrop, the discussion will feature: Jamie Alexandre: Co-founder and co-executive director of Learning Equality, a nonprofit dedicated to supporting children’s learning in the most marginalized contexts Krista Belen Rivas Gutierrez: Global leader in the Tertiary Refugee Student Network, a student led network that aims to increase refugee self-reliance by connecting refugee learners and alumni at the local, national, and global level Mati Amin: Co-founder and CEO of SOLAx, a WhatsApp based online academy where students can access daily, asynchronous class work in three languages Viewers can submit questions by emailing events@brookings.edu or on X/Twitter @BrookingsGlobal using #AIinEducation. Virtual: https://events.vtools.ieee.org/m/484339

Introduction to Electronic Reliability in the Age of AI

Bldg: Main Cafeteria, MIT Lincoln Laboratory, 244 Wood Street, Lexington, Massachusetts, United States, 02421, Virtual: https://events.vtools.ieee.org/m/483183

Electronics play a crucial role across all industry sectors, especially as systems become more interconnected, cloud-based, electrified, and powered by artificial intelligence (AI). This applies not only to existing electronics but also to emerging technologies pushing the boundaries of scale, data speed, power, and AI-driven innovations. Emerging technologies that are major drivers for electronics growth include Hyperscalars driven by AI and machine learning, IOT, EV and autonomous vehicles. Generative AI has been driving demand for high performance GPU based servers and increased loads at data centers. Chip makers have in turn been focused on development of MPUs and GPUs optimized for AI. 5 and 6G applications likewise require sensing, computation and transfer of large volumes of data without latency. All these applications have been pushing electronics towards heterogenous integration with 2.5 and 3D chiplets which allow for greater speeds, functionality and smaller footprints. However, these newer designs, materials and shrinking of scale cause thermal management and reliability issues in electronics introducing new failure sites and modes. This seminar will focus on the critical role reliability plays in the design, manufacturing, and long-term performance of electronic systems. The presentation will start with an overview of the semiconductor supply chain, answering questions such as “who are the key players in various industries?” and “what is driving innovation and how is it taking shape?” The session will continue with addressing key foundational electronics reliability concepts such as the bathtub curve, the difference between reliability physics and handbook calculations, prognostic health management, and common failure mechanisms. Additional time will be spent describing the reliability challenges presented by advanced packaging, like 3D heterogeneous integrated packages To address the evolving topic of electronics reliability as industry needs evolve, Ansys, in collaboration with IEEE, is hosting an Electronics reliability tutorial series that explore electronic component reliability, key electronic failure mechanism and root cause, manufacturing reliability, and simulation/testing for reliability. These tutorials are offered as bundles for continuing education credit with an electronics reliability certificate from IEEE. Speaker(s): Dr. Jon Kordell, Bldg: Main Cafeteria, MIT Lincoln Laboratory, 244 Wood Street, Lexington, Massachusetts, United States, 02421, Virtual: https://events.vtools.ieee.org/m/483183

IEEE Networking Opportunity and Member-Led Discussions on a Broad Range of Topics

Room Londonderry, NH, United States

This IEEE New Hampshire meeting provides a unique opportunity for members and professionals to connect, exchange knowledge, and explore industry trends. The agenda includes an open-floor discussion on topics of interest identified by members and participants, including emerging technologies, AI, cybersecurity, and consulting best practices. Members are encouraged to take the lead in discussions, sharing insights and best practices. The session will also provide networking opportunities to foster collaboration. If you are interested in leading a discussion, please email the topic and brief one paragraph summary by April 11th to rajeshwarvv@yahoo.com. Speaker(s): Raj Vayyavur Agenda: Welcome & Introductions (5 min) Member Interests & Discussion Topics (45 min) Networking & Collaboration Opportunities with Pizza and Drinks (30 min) Next Steps & Closing Remarks (10 min) Room: Classroom Conference Room, 50 Woodmont Ave, Londonderry, New Hampshire, United States

ExCom NH Section May 21, 7pm

Virtual: https://events.vtools.ieee.org/m/461767

May NH Section ExCom meeting Virtual: https://events.vtools.ieee.org/m/461767

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