PCBA Mfg. Facility Tours followed by three Presentations about electronics manufacturing quality and packaging as a root cause of failure
The meeting will start with PCBA Mfg. Facility Tours followed by three Presentations which are as follows: - Driving Quality in Electronics Manufacturing: Advanced Packaging, Process Tools, and Smart Package Selection. Presented by Matteo Forgione of Forgione Engineering - Packaging Selection as a Root Cause of Failure in Microelectronics Chip Tray and Waffle Pack Systems. Presented by Katherine Kutina of Forgione Engineering - What changed at APEX and Why it Matters, a review of APEX 2026. Presented by Leo Lambert of Eptac Corporation Co-sponsored by: SMTA Boston Chapter, iMAPS NE Chapter, and the IEEE Boston Reliability Chapter Speaker(s): Matteo , Katia, Leo Agenda: Agenda: 5:00 PM – 6:30 PM Registration, Networking, Table Top Displays/Demos, Manufacturing Facility Tours 6:00 PM – 7:00 PM Italian Buffet Dinner 7:00 PM – 7:30 PM Announcements, Presentation: Overview of Mack Technologies 7:30 PM – 8:00 PM Presentation 1 – Driving Quality in Electronics Mfg.: Advanced Packaging, Process Tools & Smart Package Selection, Q&A 8:00 PM – 8:30 PM Presentation 2 – Packaging Selection as a Root Cause of Failure in Microelectronics Chip Tray, & Waffle Pack Systems, Q&A 8:30 PM – 9:15 PM Presentation 3 – What changed at APEX and Why it Matters, a review of APEX 2026, Q&A 9:15 PM – 9:30 PM Closing Announcements, Meeting Adjourns Mack Technologies, 27 Carlisle Road, Westford, Massachusetts, United States, 01886