7 events found.
Week of Events
Monday, June 15, 2026
No events on this day.
Tuesday, June 16, 2026
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June 16, 2026 -PCBA Mfg. Facility Tours followed by three Presentations about electronics manufacturing quality and packaging as a root cause of failure
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June 16, 2026 -PCBA Mfg. Facility Tours followed by three Presentations about electronics manufacturing quality and packaging as a root cause of failure
PCBA Mfg. Facility Tours followed by three Presentations about electronics manufacturing quality and packaging as a root cause of failure
The meeting will start with PCBA Mfg. Facility Tours followed by three Presentations which are as follows: - Driving Quality in Electronics Manufacturing: Advanced Packaging, Process Tools, and Smart Package Selection. Presented by Matteo Forgione of Forgione Engineering - Packaging Selection as a Root Cause of Failure in Microelectronics Chip Tray and Waffle Pack Systems. Presented by Katherine Kutina of Forgione Engineering - What changed at APEX and Why it Matters, a review of APEX 2026. Presented by Leo Lambert of Eptac Corporation Co-sponsored by: SMTA Boston Chapter, iMAPS NE Chapter, and the IEEE Boston Reliability Chapter Speaker(s): Matteo , Katia, Leo Agenda: Agenda: 5:00 PM – 6:30 PM Registration, Networking, Table Top Displays/Demos, Manufacturing Facility Tours 6:00 PM – 7:00 PM Italian Buffet Dinner 7:00 PM – 7:30 PM Announcements, Presentation: Overview of Mack Technologies 7:30 PM – 8:00 PM Presentation 1 – Driving Quality in Electronics Mfg.: Advanced Packaging, Process Tools & Smart Package Selection, Q&A 8:00 PM – 8:30 PM Presentation 2 – Packaging Selection as a Root Cause of Failure in Microelectronics Chip Tray, & Waffle Pack Systems, Q&A 8:30 PM – 9:15 PM Presentation 3 – What changed at APEX and Why it Matters, a review of APEX 2026, Q&A 9:15 PM – 9:30 PM Closing Announcements, Meeting Adjourns Mack Technologies, 27 Carlisle Road, Westford, Massachusetts, United States, 01886
PCBA Mfg. Facility Tours followed by three Presentations about electronics manufacturing quality and packaging as a root cause of failure
The meeting will start with PCBA Mfg. Facility Tours followed by three Presentations which are as follows: - Driving Quality in Electronics Manufacturing: Advanced Packaging, Process Tools, and Smart Package Selection. Presented by Matteo Forgione of Forgione Engineering - Packaging Selection as a Root Cause of Failure in Microelectronics Chip Tray and Waffle Pack Systems. Presented by Katherine Kutina of Forgione Engineering - What changed at APEX and Why it Matters, a review of APEX 2026. Presented by Leo Lambert of Eptac Corporation Co-sponsored by: SMTA Boston Chapter, iMAPS NE Chapter, and the IEEE Boston Reliability Chapter Speaker(s): Matteo , Katia, Leo Agenda: Agenda: 5:00 PM – 6:30 PM Registration, Networking, Table Top Displays/Demos, Manufacturing Facility Tours 6:00 PM – 7:00 PM Italian Buffet Dinner 7:00 PM – 7:30 PM Announcements, Presentation: Overview of Mack Technologies 7:30 PM – 8:00 PM Presentation 1 – Driving Quality in Electronics Mfg.: Advanced Packaging, Process Tools & Smart Package Selection, Q&A 8:00 PM – 8:30 PM Presentation 2 – Packaging Selection as a Root Cause of Failure in Microelectronics Chip Tray, & Waffle Pack Systems, Q&A 8:30 PM – 9:15 PM Presentation 3 – What changed at APEX and Why it Matters, a review of APEX 2026, Q&A 9:15 PM – 9:30 PM Closing Announcements, Meeting Adjourns Mack Technologies, 27 Carlisle Road, Westford, Massachusetts, United States, 01886
Wednesday, June 17, 2026
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June 17, 2026 -ExCom Jun 17, 7pm virtual
ExCom Jun 17, 7pm virtual
Monthly New Hampshire Section ExCom Meeting Virtual: https://events.vtools.ieee.org/m/533059
Thursday, June 18, 2026
No events on this day.
Friday, June 19, 2026
No events on this day.
Saturday, June 20, 2026
No events on this day.
Sunday, June 21, 2026
No events on this day.